By G.Q. Zhang
This e-book is written via best specialists with either profound wisdom and wealthy sensible event in complex mechanics and the microelectronics crucial for present and destiny improvement. It goals to supply the leading edge wisdom and suggestions for numerous mechanical similar difficulties, in a scientific manner. It includes very important and special information regarding the cutting-edge theories, methodologies, the best way of operating and genuine case studies.
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Bumping involves building metal pillars or balls at the contact areas either before or after singulation. That can be done through electroplating, stencil printing, or stud bumping, the latter being an abbreviated version of the wire bonding process just described, but now with the wire sheared off just above the bond pad. Stud bumping does not require special die pretreatment. In most other cases, the bond pads have to be covered first with an underbump metallization to provide reliable contact.
Pressure sensing involves a thin free-standing Si or piezoelectric material membrane. A special version of a pressure sensor is the solid-state microphone; in a modified design the microphone may double as loudspeaker. The dominant MEMS actuators are the dies that form the ejection part of an inkjet printer head, and the digital mirror device that is the imaging part in many video projectors. Applications related to actuators are solid-state resonators, which includes surface and bulk acoustic wave devices, and RFMEMS, high-quality-factor mechanical RF switches operated by applying a DC voltage across the tongues.
Microelectronics Technology 17 Still other methods have been proposed to solve the interconnect delay problem. An approach receiving much attention nowadays is 3D Interconnect, where multiple very thin die (~10 µm) are stacked on top of each other, each die connected to the next by thru-wafer metallization. In this way, the number of metal layers in each die can be limited, and so the delay time. Whether the required combination of extreme wafer thinning, high-aspect ratio thru-hole etching, and accurate wafer-to-wafer bonding will result in cost-effective manufacturing still remains to be seen.