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By Volker Saile, Ulrike Wallrabe, Osamu Tabata, Visit Amazon's Jan G. Korvink Page, search results, Learn about Author Central, Jan G. Korvink, , Oliver Brand, Gary K. Fedder, Christofer Hierold

Overlaying technological elements in addition to the suitability and applicability of assorted varieties of makes use of, this guide exhibits optimization innovations, options and meeting pathways to accomplish the combo of complicated, even third-dimensional constructions with easy production steps. The authors supply details on markets, commercialization possibilities and features of mass or large-scale construction in addition to layout instruments, experimental concepts, novel fabrics, and ideas for destiny advancements. not just do they weigh up rate as opposed to volume, additionally they ponder CMOS and LIGA strategies.
Of curiosity to physicists, electronics engineers, fabrics scientists, institutional and commercial libraries in addition to graduate scholars of the appropriate disciplines.Content:
Chapter 1 creation: LIGA and Its functions (pages 1–10): Prof. Dr. Volker Saile
Chapter 2 X?Ray mask for LIGA Microfabrication (pages 11–50): Yohannes Desta and Jost Goettert
Chapter three cutting edge publicity recommendations for 3D Microfabrication (pages 51–68): Naoki Matsuzuka and Prof. Dr. Osamu Tabata
Chapter four scorching Embossing of LIGA Microstructures (pages 69–102): Mathias Heckele and Matthias Worgull
Chapter five publicity and improvement Simulation for Deep X?Ray LIGA (pages 103–142): Prof. Dr. Jan G. Korvink, Sadik Hafizovic, Yoshikazu Hirai and Pascal Meyer
Chapter 6 layout for LIGA and secure production (pages 143–188): Ulrich Gengenbach, Ingo Sieber and Prof. Dr. Ulrike Wallrabe
Chapter 7 Commercialization of LIGA (pages 189–203): Ron A. Lawes
Chapter eight Polymer Optics and Optical MEMS (pages 205–232): Jurgen Mohr
Chapter nine Refractive X?Ray Lenses Produced via X?Ray Lithography (pages 233–242): Arndt Last
Chapter 10 RF functions (pages 243–280): Sven Achenbach and David M. Klymyshyn
Chapter eleven Evolution of the Microspectrometer (pages 281–296): Reiner Wechsung, Sven Schonfelder and Andreas Decker
Chapter 12 Actuator Manufacture with LIGA tactics (pages 297–321): Todd Christenson
Chapter thirteen improvement of Microfluidic units Created through the LIGA strategy (pages 323–335): Masaya Kurokawa
Chapter 14 program of Inspection units (pages 337–349): Yoshihiro Hirata
Chapter 15 The Micro Harmonic force equipment (pages 351–394): Reinhard Degen and Rolf Slatter
Chapter sixteen Microinjection Molding Machines (pages 395–414): Christian Gornik
Chapter 17 stuffed face up to platforms (pages 415–441): Thomas Hanemann, Claas Muller and Michael Schulz
Chapter 18 Dramatic Downsizing of sentimental X?Ray Synchrotron gentle resource from Compact to Tabletop (pages 443–452): Hironari Yamada, Norio Toyosugi, Dorian Minkov and Yoshiko Okazaki
Chapter 19 PTFE Photo?Fabrication via Synchrotron Radiation (pages 453–468): Takanori Katoh and Yanping Zhang

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Nachman, R. M. (1990) Thermoelastic effects in X-ray lithography masks during synchrotron storgae ring irradiation. Microelectronic Engineering, 11, 287–93. 48 Zetter, T. (1994) UETP – MEMS: Training in Microsystems. LIGA Technique, Swiss Foundation for Research in Microtechnology. p. 140. E. and Chaker, M. (1993) Physical properties of the X-ray membrane materials. Journal of Vacuum Science Technology B, 11, 2930–7. , Munchmeyer, D. and Schelb, W. (1986) Mask making for synchrotron radiation lithography.

Journal of Vacuum Science Technology B, 9, 154–61. Honma, H. and Kagaya, Y. (1993) Gold plating using the disulfite–aurate complex. Journal of the Electrochemical Society, 140, L135–7. Horkans, J. T. (1977) Pulsed potentiostatic deposition of gold from solutions of the Au(I) sulfite complex. Journal of the Electrochemical Society, 124, 1499–505. G. and Okinaka, Y. (1983) High speed gold plating: anodic bath degradation and search for stable low polarization anodes. Journal of the Electrochemical Society, 130, 2149–57.

An absorber structure of ∼5 µm height is electroplated into the resist template and the photoresist is stripped [step (c)]. In the next step (d), a thick layer of SU-8 resist is applied on top of the intermediate mask pattern and prebaked. The thickness of this layer can range from 20 to 50 µm. Subsequently, an X-ray exposure is performed from the back side of the intermediate mask using soft X-rays [step (e)] followed by a post-exposure bake and development process. In the final step (f ), additional gold is electrodeposited on top of the now open gold absorber, allowing its thickness to be increased to 30 µm or even greater.

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