By Tapan K. Gupta
This can be the 1st instruction manual at the fabrication and layout of hybrid microelectronic circuits.
* bargains with all features of the expertise, layout, structure and processing of materials.
* Fills the necessity for a complete survey of a widely-used technology.Content:
Chapter 1 advent (pages 1–39):
Chapter 2 Mathematical Foundations, Circuit layout, and format principles for Hybrid Microcircuits (pages 40–88):
Chapter three Computer?Aided layout and trend iteration recommendations (pages 89–125):
Chapter four Thick?Film basics (pages 126–160):
Chapter five Thick?Film Deposition innovations (pages 161–179):
Chapter 6 Thin?Film basics (pages 180–220):
Chapter 7 Thin?Film Deposition options (pages 221–243):
Chapter eight part meeting and Interconnections (pages 244–275):
Chapter nine Adjustment of Passive elements (pages 276–299):
Chapter 10 Packaging and Thermal issues (pages 300–330):
Chapter eleven Multichip Module and Microwave Hybrid Circuits (pages 331–384):
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Extra info for Handbook of Thick- and Thin-Film Hybrid Microelectronics
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