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By M. Brimicombe [low qual scan]

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Another novel development was to transport the parts directly out of the tooling system with a novel part-carrying system [83]. The machine is also equipped with a force-displacement monitoring system which reads the data directly from the tooling. The Institute of Production (IFP) of the University of Applied Science Cologne, Germany, leads the development of the first generation hydroforming machine for the forming of miniature/micro-tubular components [84,85]. Hydorforming processes have been employed successfully in industry to produce mass products predominantly relating to lightweight automotive components.

Any asymmetry may bring in difficulty in controlling the quality in micro-shaping. Excessive material accumulation, large reductions in area, and sudden changes of the sections should also be avoided in forming/shaping. Others include the design of the draft for the workpiece for micro-forging, permitted drawing ratios and profiles of the drawn products in micro-sheet forming, etc. Conventional rules on shape capability of manufacturing may not be applicable to micro-manufacturing largely due to size effects needing to be considered and limitations to the tool shapes that can be produced.

For example, combining lithographic tooling and injection molding techniques can enable the mass production of microcomponents with various materials such as polymers, metals, and ceramics [66]; and an LIGA process could be improved by fabricating micro-molds with direct femtosecond laser micro-machining [67]dan approach may lead to practical, cost-effective 3D MEMS with various materials. Ultraprecision manufacturing of self-assembled micro-systems is another example of this kind of development, Micro-manufacturing methods and processes which combines ultraprecision micro-machining such as milling, turning, drilling, and grinding with sacrificial/structural multilayer manufacturing processes to produce self-assembled, 3D micro-systems and associated meso-scale interfaces from a variety of materials for MEMS applications [68].

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